LMK107B7225KA-TR Features Item Summary 2.2uF10%, 10V, X7R, 0603/1608 (EIA/JIS) Lifecycle Stage Mass Production (Preferred) Standard packaging quantity (minimum) Taping Paper 4000pcs Products characteristics table External Dimensions 2.2 uF 10 % Dimension L 1.6 0.10 mm Case Size (EIA/JIS) 0603/1608 Dimension W 0.8 0.10 mm Rated Voltage 10 V Dimension T 0.8 0.10 mm Dimension e 0.35 0.25 mm Capacitance tan (max) 10 % Temperature Characteristic (EIA) X7R Operating Temp. Range (EIA) -55 to +125 High Temperature Loading 150 % (% Rated Voltage) Insulation Resistance (min) 100 M*F RoHS Compliance (10 subst.) Yes REACH Compliance (209 subst.) Yes Halogen Free Yes Soldering Reflow 2020.11.24 The data is reference only. Electrical characteristics vary depending on environment or measurement condition. TAIYO YUDEN reserves the right to make change to the data at any time without notice. Before making final selection, please check product specification. http://www.ty-top.com Powered by TCPDF (www.tcpdf.org) M
LMK107B7225KA-TR Features Item Summary 2.2uF10%, 10V, X7R, 0603/1608 (EIA/JIS) Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 4000pcs Products characteristics table External Dimensions 2.2 uF 10 % Dimension L 1.6 0.10 mm Case Size (EIA/JIS) 0603/1608 Dimension W 0.8 0.10 mm Rated Voltage 10 V Dimension T 0.8 0.10 mm Dimension e 0.35 0.25 mm Capacitance tan (max) 10 % Temperature Characteristic (EIA) X7R Operating Temp. Range (EIA) -55 to +125 High Temperature Loading 150 % (% Rated Voltage) Insulation Resistance (min) 100 M*F RoHS Compliance (10 subst.) Yes REACH Compliance (191 subst.) Yes Halogen Free Yes Soldering Reflow 2019.04.21 The data is reference only. Electrical characteristics vary depending on environment or measurement condition. TAIYO YUDEN reserves the right to make change to the data at any time without notice. Before making final selection, please check product specification. http://www.ty-top.com Powered by TCPDF (www.tcpdf.org) Multi Layer C
1000pF ADC1_GND 0.01uF 0.1uF 0.68uF 1.0uF 2.2uF - - Ceramic X7R, 50V 10% 0402 Ceramic X7R, 16V 10% 0402 Ceramic X7R 16V 10% 0805 (Murata GCM219R71C684KA37 ) Ceraminc X7R, 10V 10% 0603 (Taiyo Yuden LMK107B7105KA-T) Ceraminc X7R, 10V, 10%, 0603 (Taiyo Yuden LMK107B7225KA-TR) 4.7uF 10uF - TANT, 12.5V 20% ESR=0.08R 7343 - TANT, 35V 10% ESR=0.125R CC7343-31 D 4.7uF Alternative (150-78844)- Polymer ALU, 16V 20% ESR=0.08R 7343-18 GND Place small Caps as close as possible to MCU pins VDD_HVA VDD_HVB HVA_CAP C27 470pF C52 1000pF C22 470pF C55 1000pF C28 470pF C37 1000pF + C1 10UF C VDD_HVC HVB_CAP C40 470pF HVC_CAP C33 1000pF + C4 10UF DNP C26 0.1UF GND C53 0.1UF C23 0.1UF C54 0.1UF C30 0.1UF C38 0.1UF C42 1000pF + C5 10UF DNP C41 0.1UF GND C35 0.1UF C C44 0.1UF GND Place 10uF cap to west side of package Place small caps close to each MCU pin Ballast Transistor VDD_LV LV_CAP C24 0.1UF C51 0.1UF DNP C50 0.1UF C46 0.1UF DNP B_CAP C8 B C32 0.1UF GND C39 0.1UF C45 0.1UF DNP C21 0.1UF DNP C25 0.1UF DNP E_CAP L
C94 C93 C97 C96 C95 C118 1uF 0.1UF 1uF 0.1UF 1uF 2.2UF GND GND GND 0.68uF - Ceramic X7R, 16V 1uF - Ceramic X7R, 10V 2.2uF - Ceramic X7R, 10V D 10% 0805 (Murata GCM219R71C684KA37) 10% 0603 Low ESR (Taiyo Yuden LMK107B7105KA-T) 10% 0603 Low ESR (Taiyo Yuden LMK107B7225KA-TR) GND Place small Caps as close as possible to MCU pins VDD_HVA VDD_HVB HVA_CAP HVB_CAP C112 2.2UF C C109 0.1UF C120 0.1UF C92 0.1UF C100 0.1UF C99 C 0.1UF GND GND One 0.1uF cap per VDD_HV_x pin. Place as close as possible to pin VDD_LV Ballast Transistor LP Internal Reg Cap LV_CAP B_CAP B C110 0.68uF C111 0.68uF C27 0.68uF (low (low (low ESR) ESR) ESR) C108 0.1UF C116 0.1UF C98 0.1UF C113 0.1UF E_CAP C_CAP C119 4700pF VDD_LV (1.25V) Decoupling. Place one of the 0.1uF caps close to each VDD_LV GND pin. Place the 0.68uF caps on each side of the package such that there is LVDEC_CAP C122 2.2UF C117 1uF B GND GND no cap on the side with the ballast transistor (For regulator stability the total capacitance should be around 2.2uF). Pla
1000pF ADC1_GND 0.01uF 0.1uF 0.68uF 1.0uF 2.2uF - - Ceramic X7R, 50V 10% 0402 Ceramic X7R, 16V 10% 0402 Ceramic X7R 16V 10% 0805 (Murata GCM219R71C684KA37 ) Ceraminc X7R, 10V 10% 0603 (Taiyo Yuden LMK107B7105KA-T) Ceraminc X7R, 10V, 10%, 0603 (Taiyo Yuden LMK107B7225KA-TR) 4.7uF 10uF - TANT, 12.5V 20% ESR=0.08R 7343 - TANT, 35V 10% ESR=0.125R CC7343-31 D 4.7uF Alternative (150-78844)- Polymer ALU, 16V 20% ESR=0.08R 7343-18 GND Place small Caps as close as possible to MCU pins VDD_HVA VDD_HVB HVA_CAP C27 470pF C24 1000pF C48 470pF HVB_CAP C46 1000pF + C2 10UF C C23 470pF + C1 10UF DNP C26 0.1UF GND C25 0.1UF C47 0.1UF C45 0.1UF C C22 0.1UF GND Place 10uF cap to west side of package Place small caps close to each MCU pin VDD_LV Ballast Transistor LV_CAP C50 0.1UF C20 0.1UF B_CAP C7 E_CAP C37 0.1UF GND LV_CAP LVDEC_CAP 4700pF C8 2.2UF DNP (low ESR) Place close to transistor B LP Internal Reg Cap E_CAP C9 2.2UF DNP (low ESR) C49 0.68uF (low ESR) C29 0.1UF C30 0.68uF (low ESR) C21 0.68uF (low ESR) C28