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Samsung.com/K8C5515EBM-DC1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"70 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"COMMERCIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"0.0 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","O...
1639 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515EBM-DE1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"85 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"OTHER","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"-25 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","Organi...
1630 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515EBM-FC1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"70 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"COMMERCIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"0.0 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","O...
1628 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515EBM-FE1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"85 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"OTHER","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"-25 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","Organi...
1621 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515ETM-DC1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"70 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"COMMERCIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"0.0 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","O...
1639 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515ETM-DE1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"85 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"OTHER","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"-25 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","Organi...
1631 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515ETM-FC1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"70 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"COMMERCIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"0.0 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","O...
1626 Bytes - 19:57:22, 21 December 2024
Samsung.com/K8C5515ETM-FE1F
{"Terminal Pitch":"0.8000 mm","Terminal Form":"BALL","Operating Temperature-Max":"85 Cel","Number of Words Code":"16M","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"OTHER","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"-25 Cel","Number of Words":"1.68E7 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"100 ns","Memory Density":"2.68E8 deg","Supply Voltage-Max (Vsup)":"1.95 V","Supply Voltage-Min (Vsup)":"1.7 V","Organi...
1619 Bytes - 19:57:22, 21 December 2024
Various/GC5515E
{"Semiconductor Material":"GaAs","Package":"Pill-B","f(co) Min. (Hz) Cut-off freq.":"400G","V(RRM)(V) Rep.Pk.Rev. Voltage":"6.0","Ct{Cj} Nom. (F) Junction Cap.":"550f","Military":"N","@V(T){V(J)}(V)(Test Condition)":"0"}...
664 Bytes - 19:57:22, 21 December 2024
Various/GC5515E30
{"Semiconductor Material":"GaAs","Package":"Pill-C","f(co) Min. (Hz) Cut-off freq.":"400G","V(RRM)(V) Rep.Pk.Rev. Voltage":"6.0","Ct{Cj} Nom. (F) Junction Cap.":"550f","Military":"N","@V(T){V(J)}(V)(Test Condition)":"0"}...
673 Bytes - 19:57:22, 21 December 2024
Various/GC5515E45
{"Semiconductor Material":"GaAs","Package":"Pin","f(co) Min. (Hz) Cut-off freq.":"400G","V(RRM)(V) Rep.Pk.Rev. Voltage":"6.0","Ct{Cj} Nom. (F) Junction Cap.":"550f","Military":"N","@V(T){V(J)}(V)(Test Condition)":"0"}...
671 Bytes - 19:57:22, 21 December 2024
Various/GC5515E70
{"Semiconductor Material":"GaAs","Package":"Pin","f(co) Min. (Hz) Cut-off freq.":"400G","V(RRM)(V) Rep.Pk.Rev. Voltage":"6.0","Ct{Cj} Nom. (F) Junction Cap.":"550f","Military":"N","@V(T){V(J)}(V)(Test Condition)":"0"}...
671 Bytes - 19:57:22, 21 December 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
File Name | File Size (MB) | Document | MOQ | Support |
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INSTRUCTION_SHEET_MANUAL_CP_B_EXT_2_EXTENSION_MODULE_FOR_BUFFER_MODULES_CP_B_RANGE.pdf | 0.38 | 1 | Request | |
ACS880_C132_MARINE_TYPE_APPROVED_DRIVE_MODULES_AND_MODULE_PACKAGES_SUPPLEMENT.pdf | 0.84 | 1 | Request | |
BROCHURE_NEW_TFIO_MODULES_HIGH_SPEED_PULSE_COUNTER_MODULE.pdf | 1.43 | 1 | Request | |
OPERATING_MANUAL_PACDRIVE_INTELLIGENT_SERVO_MODULE_AND_OPTION_MODULES.pdf | 3.09 | 1 | Request | |
PROCONTROL_P14_88GV30_R1110_MODULE_LINK_CENTRAL_MODULE.pdf | 0.04 | 1 | Request | |
PROCONTROL_P14_88TU01_R1000_MONITORING_MODULE_FOR_STATION_BUS_CONTROL_MODULE.pdf | 0.27 | 1 | Request | |
PG_MODULE.pdf | 0.44 | 1 | Request | |
MULTI_FUNCTION_MODULE.pdf | 0.58 | 1 | Request | |
DDR3_SDRAM_MODULE_0.pdf | 0.30 | 1 | Request | |
SAMSUNG_DRAM_MODULE_HANDLING_GUIDE_1128.pdf | 5.45 | 1 | Request | |
SAMSUNG_DRAM_MODULE_HANDING_GUIDE.pdf | 2.14 | 1 | Request | |
POWERBLOC_12_24_KV_AIR_INSULATED_MEDIUM_VOLTAGE_SWITCHGEAR_MODULE.pdf | 1.81 | 1 | Request |