24-6570-18 CONN IC DIP SOCKET ZIF 24POS
From Aries Electronics
| Category | Connectors, Interconnects |
| Contact Finish - Mating | Nickel Boron |
| Contact Finish - Post | Nickel Boron |
| Contact Finish Thickness - Mating | 50µin (1.27µm) |
| Contact Finish Thickness - Post | 50µin (1.27µm) |
| Contact Material - Mating | Beryllium Nickel |
| Contact Material - Post | Beryllium Nickel |
| Contact Resistance | - |
| Current Rating | 1A |
| Datasheets | 57 Series |
| Family | Sockets for ICs, Transistors |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Operating Temperature | - |
| Packaging | Bulk |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 57 |
| Standard Package | 10 |
| Termination | Solder |
| Termination Post Length | 0.110" (2.78mm) |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
